July 20, 2020

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Eugenus Launches QXP+ Thermal ALD Platform

Eugenus Inc. has unveiled the launch of the QXP+ Advanced Thermal ALD, a new generation of its single-wafer multi-station ALD product that incorporates innovative improvements in the production-proven platform’s throughput and reliability for high-volume manufacturing.

The QXP+ demonstrates enhanced technical capabilities that elevate the productivity and reliability of precision control in the deposition profile, as well as software improvements for better user experience and cost-efficiency. By cutting nonuniformity nearly in half and enabling station-to-station matching, key feature upgrades such as the dual zone heater and external centering to adjust concentricity provide valuable improvements as the QXP+ expands upon existing core technology. While maintaining previous generation process transparency and high-volume shipment of the QXP 8300, the updated platform will also enable future enhancements and continuous improvement for users going forth. Key memory customers will be making the transition to the new ALD model, as Eugenus prepares to expand the QXP+ portfolio of films to be ready for Customer Demo in Q4 2020 and commercial availability early 2021.

“We are happy to announce our consistent growth and long tradition of innovation through our new and improved QXP+.” states Peter Um, Chairman and CEO of Eugenus. “As we proudly put forth significant improvements in productivity with nearly a 10% increase in process of record and a 50% Mechanical TPUT increase, we strive to enable our customers to efficiently meet today’s challenges and future requirements with constantly improving R&D capabilities and results. We hope to always position and prove ourselves as a consistently excelling player in providing next level ALD solutions for our valued customers.”