EUGENUS EDGE
INNOVATION BUILT IN
Transform to the modern approach to solve your semiconductor challenges and meet customer requirements. It starts with our system engineering and process expertise; advanced R&D collaborations; and world-class, high-volume manufacturing (HVM). With more than 200+ patents, we offer the competitive advantage to get products to market faster and with greater cost-efficiencies than ever before.
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BROAD SOLUTIONS PORTFOLIO
Falcon
Harrier-M&L
PROCESSES
Group IV Thin Films
Metal Thin Films
High-k Films
Low-k Films
PRODUCTS
MINI-BATCH & BATCH FURNACE
PRODUCTS
QXP+ ALD
QXP 8300
PROCESSES
Metal Thin Films
High-k Films
SINGLE CHAMBER MULTI-STATION THERMAL ALD
PRODUCTS
BlueJay
IXP CVD
PROCESSES
Group IV Thin Films
Metal Thin Films
Low-k Films
SINGLE WAFER THERMAL CVD
PRODUCTS
Albatross
PROCESSES
Low-k Films
PLASMA DENSIFICATION
PRODUCTS
Hawk
PROCESSES
Low-k Films
PLASMA
PRE-CLEAN
Our application lab and innovation centers in Silicon Valley and Korea focus on collaborative research and leverage cutting-edge technical resources to find solutions to your chipmaking challenges with unmatched speed. We continually increase innovation efforts through new and enhanced strategic R&D partnerships, working alongside research groups from universities, industry groups, and clients.
GLOBAL R&D, LOCAL SOLUTIONS
Eugenus partners with Eugene Technology, located at the global hub for world-class, HVM manufacturing, in Hobeop, Korea. The premier semiconductor equipment manufacturing facilities also include comprehensive test and assembly capabilities. To accommodate our increasing customer volume requirements, the manufacturing center was recently expanded to scale capacity for future growth.