Reimagining the future of semiconductor innovation
Power up with Eugenus – manufacturing that enables the next wave of chip breakthroughs
Engineered for impact
Smart solutions, built to solve and scale
Memory
Manufacturing
From high-speed DRAM to high-density 3D NAND, our systems are trusted in high-volume production by leading memory fabs.
Products
Advanced Logic Devices
For leading-edge logic nodes and GAA transistors, our ALD solutions enable precise film control and low-defect integration.
Products
Power
Devices
Power electronics demand durability, uniformity, and material versatility – and our tools deliver.
Products
Emerging
Memories
Emerging Memory technologies such as FeRAM, PCRAM, MRAM need new materials that are enabled by Lassen
Products
Precision + Performance = Disruption
From intricate designs to high-volume production, Eugenus provides differentiated deposition solutions across ALD (Atomic Layer Deposition) and CVD (Chemical Vapor Deposition) technologies for advanced memory and logic devices. Built on a rich legacy of materials engineering and process innovation, Eugenus empowers semiconductor leaders to scale with speed, accuracy, and agility.
Our platforms are trusted for DRAM, 3D NAND, and logic applications, enabling next-gen architectures through process mastery and proven performance in high-volume manufacturing.
R&D-focused innovation to solve real-world challenges
We combine Silicon Valley innovation with Korean precision to deliver differentiated & high-impact semiconductor process solutions across the globe. As a wholly owned subsidiary of Eugene Technology, we design and develop advanced ALD systems that drive the semiconductor industry forward – combining cutting-edge R&D with reliable high-volume manufacturing.
Explore how we are addressing tough technical challenges while meeting COO targets.
Why Eugenus
From mission-critical deployments to cutting-edge innovation, our track record is built on facts that tell a story of scale, trust, and impact. These figures reflect the confidence global enterprises and clients place in us.
Systems running in production fabs
Revenue in CY’25
Issued/Published in ALD and Advanced Materials
For DRAM, 3D NAND, and logic GAA
27001/9001/14001/45001
With Tier-1 memory and logic companies